By using Ar ion sputtering and X-ray photoelectron spectroscopy, the oxygen contents between the copper plating layer and iron substrate were examined and the existence of oxygen layer was proved.

• 采用氢离子溅射和X射线光电子能谱相结合的方法，检测焦磷酸盐镀铜层和铁基体界面区含氧量的变化，证明了氧化层的存在。