By means of some advanced measure techniques,such as Differential Thermal Analysis(DTA),Sweep Electron Mierosope(SEM), the mecha nism of drying, core bonding and water-solution of this core are approached.

• 较详细地介绍了应用差热分析，电镜分析等近代测试手段，探讨制芯材料在烘干时的硬化过程，获得干强度的粘结机理以及水溶性机理的情况。