Based on the thermal conduct theory and cure kinetics,the history of cure temperature and degree of cure was investigated for the orthotropic laminate during curing.

• 根据热传导和固化动力学理论,采用三维有限元方法,对正交各向异性复合材料层合板固化过程的温度和固化度历程及其变化规律进行数值模拟研究。