As the bath allows the operation at higher current densities,it can be used for the automatic gold plating or rolling gold plating system for the plugs or the edge tabs of printed circuit board.

• 由于该镀液能在高电流密度下操作,因而在电子工业中可用于印制电路板插头及其簧片的自动镀金和高速滚镀金系统。