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- Al bonding pads 铝焊垫
- In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process. 在微电子中,使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度,锡膏在晶片焊盘过焊。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- To avoid this problem, the effective bonding pad sizes and spacing must be reduced. 为了避免这个问题,有效的键合压脚尺寸和间距都必须减少。
- Jeon I and Chung Q,“The study on failure mechanisms of bond pad metal peeling: Part A-Experimental investigation. 张恒硕;“电子构装金线接点破坏机构及显微组织分析;”国立中山大学材料科学研究所博士论文;2002.
- LTD,the new type of bonding pad roll with complex curve roller contour is design,it avoid point and arc touching between the bevel edge of outside welding and roller sur. 根据宝鸡石油钢管有限责任公司承揽的印度“东气西输管线”钢管生产工艺要求,设计了一种复合曲线辊型的焊垫辊。
- The failure mechanism of lifted bond pad was analyzed through chemical decapsulation and SEM/EDX technologies in this paper. 其中,一种发生频率高的失效模式是金球在键合点的脱落。
- Because of the baking in the oven, the epoxy built out EBO to influence the bond pad and induced bond pad contamination by EBO. 由于需在烤箱中烘烤,造成银胶熏胶或胶油扩散去影响焊垫因而导致焊垫污染脏污。
- Analysis of Key Technique in Bonding Pad Design in SMT SMT焊盘设计中关键技术的分析
- Al causes operated to bring about the war. 那场战争的起因有几个。
- The concert included works by Mozart et al. 音乐会上演奏莫扎特等人的作品。
- My name is Alexander, "Al" for short. 我叫亚历山大,简称艾尔。,我的名字叫亚历山大,简称“亚尔”。
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- He jotted down a note on the pad by the telephone. 他在电话机旁的便笺本草草记下一个通知。
- Football and hockey players wear shoulder pads. 足球和曲棍球球员都戴垫肩。
- This glue makes a good firm bond. 这种胶水粘得很结实。
- Common tastes form a bond between the two men. 共同的爱好使两人结交为朋友。
- The nurse put a clean pad of cotton over his wound. 护士在他的伤口上敷了一块干净的纱布垫。
- A Method of Automatic Recognition of Bonding Pad and its Application 一种芯片焊盘自动识别方法及其应用