Aiming at the technology demand of advanced copper interconnection,the effect of pulse current density on Cu layer properties such as resistance,crystal size and surface roughness were investigated.

• 针对先进纳米铜互连技术的要求,研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。