Aiming at the technology demand of advanced copper interconnect, the effect of current density on Cu layer properties such as resistance, crystal size and surface roughness were investigated.

• 针对先进纳米集成电路铜互连技术的要求，本文研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。