A double-sides layout, six layers laminated multichip model with full metal package ispresented for a 500MHz mix-signal microsystem integration. The transmission line is simulated bySpecctraQuest .

• 提出了一种全金属管壳封装、双面布局/六层布线的叠层多芯片组件微系统结构, 以实现500MHz高速数模混合微系统集成,并借助SpecctraQuest软件仿真了基板上关键互连线的传输特性。