通用灌封密封化合物，可用来保护电子元器件、组件以及精密系统等，有着优秀的电气性能，低温弹性高温坚固，可根据不同的固化情况来选择固化剂。

• Multi-purpose casting/encapsulating, potting and sealing compound, used successfully to protect electronic components, assemblies and delicate systems, Exhibits excellent electrical properties, low temperature flexibility and high temperature stability, A variety of catalysts are available for different cure situations.